Library
Blog
Topic
Type
Year
Author
Product Type
Share Your Solar Images
Do you have interesting pictures of a solar installation, solar cells, or solar module assembly that you'd like to share? Do you have a really specialized application that you want the world to
HubSpot Interviews Rick Short On Blogging In B2B Marcom
HubSpotis a great company, and an excellent resource for helping get the most out of social media – especially blogging. Recently they were gracious enough toask me a few questions in an
Answers to “Evaluating Someone for DOE etc”
Folks, I posted this a while back. The solutions are in red. Suppose you need to select a consultant or verify the qualifications of some of your staff to perform designed experiments (DOE),
Social Media The Focus of today’s BtoB NetMarketing Breakfast
I had the great fortune to be invited by Ellis Booker to participate in today's BtoB Magazine's (btobonline's)NetMarketing Breakfast in Manhattan. Sitting on the panel with me were three
Big Bucks, Big Bucks, No Whammies!!!
If you are like me, when you hear the term "whammy" you think back to the 80's game show called Press Your Luck. The electronics assembly industry is converging on what I like to call
Indium Wafer Bumping Optimization
A more experienced engineer than myself offered a bit of advice for wafer bump plating with indium: “Electroplating using the indium sulfamate plating bath is one method of
SAC vs. Sn/Ag for Solar Soldering
As a discussion point (read "please feel free to disagree – that's what the comments section is for"), 96.5%Sn/3.5%Ag is NOT the most well suited pb-free alloy for tabbing. I know
The Era of “Do And Gloom”
21 Things You Can Do, Right Now, To Enhance Your B2B Marcom Compliments of the2009 Annual BMA Conference For the past year we've been in, what many feel, was the era of "Doom and
Teachers are Students
I’ve always said that you learn twice as much when you are instructing – well today I had the opportunity to learn. A colleague here at Indium wanted to learn more about the assembly of
Solder Thickness for PV Interconnect
Solder thickness is important whether you are interested in tabbing ribbon, bus ribbon, or (most likely) both types of PV interconnect materials. In almost all tabbing/stringing applications, the
The End of the Professor’s Second Visit to ACME
Folks, the adventures of The Professor continue……… So far the meeting with The Professor had proven very valuable John thought.He was anxious to hear the other suggestions that The
Everyone Makes Mistakes
This is something you may have run into if you’ve ever manually dipped and placed PoP components. Yesterday while trying to hold a conversation about the package-on-package process, I lost
What is Bus Ribbon?
Bus ribbon is a very specialized interconnect for photovoltaic modules. Much like tabbing ribbon, bus ribbon is made of a copper ribbon or flat wire which is coated in solder. The solder protects the
Whatdunnit? The Mystery of “X” in Halogen-free
Indium Corporation (I say "Indium Corporation": it's actually me and my colleague Tim Jensen) is in the middle of drafting a position statement on halogen-free electronics and
A Blip or a Beginning?
Fans of the Semiconductor Packaging Blog will realize that marketing charts are a strange sight on this blog. However, I thought I would share something that I found in a recent report from the
No-Clean Flux
You may notice that many of the solar grade fluxes and solder pastes are designated 'no-clean'. This classification is used to describe a flux or flux vehicle that does not need to be removed
Au/Sn Perfected
Fact: To achieve a strong, reliable solder joint, it is important to remove all oxides from the substrate as well as the solder. Generally this is done using a compatible flux. Reality: Sometimes
The Free Lunch
Folks, The continuation of The Professor's second visit to ACME…… "Well what should we do Professor?" John said weakly. "Clearly, not shut the line down over the lunch
Wafer-Level Microsphere Bumping (Microspheres)
(Follows this post) Microsphere quality is especially important for bumping wafers. The dimensional tolerance of microspheres impacts the bump co-planarity across a wafer surface. In short, more
Corrosion of Indium-Base Solders
An area of concern for implementing indium as a thermal interface material has been its susceptibility to corrosion attack in humid conditions.Little information has been available regarding the
Not sure what you need?
Let us help.
At Indium we research, develop, and manufacture advanced electronics assembly materials solutions to the challenges of today, tomorrow, and the future.
