Stuck in a Slump? Factors Impacting Solder Paste Slump Susceptibility.
Certain solder pastes are more susceptible to experiencing slump than others due to both chemical properties and experimentation processes. Risk facto...
Solder Joints
'Weld', 'Weld', 'Weld', What Do We Have Here and How Is It Different from Soldering?
Soldering and welding are often used interchangeably in metal fabrication, but each technique is different and has a distinct application. While both ...
Reflow Oven Profiling
Reflow oven profiling can be your most powerful process validation and verification tool. It can be simplified as to not be a dreaded task to be skipp...
What the Off-Eutectic?
Indium Corporation's new off-eutectic alloy preforms ensure strong solder joints in a plethora of device and package hardware. Our off-eutectic Au...
How SEM Analysis can be used to Characterize a Solder Joint
Backscattered Electrons and Secondary Electrons are used as two different detection methods in a Scanning Electron Microscope (SEM). Each detecion met...
Introduction to Capillary Blocks® for Brazing
Find out why they are the best braze choice for your hermetic sealing application....
Introducing Indium Corporation’s Solder Tube Product Line
Solder Tubes are used for electrical joint terminations within wire harness applications....
Tech Seconds with Phil Zarrow: Best Place to Attach Thermocouples
Indium Corporation’s Tech Seconds video series answers electronics assembly industry’s most commonly asked question in 60 seconds or less....
Solder Fortification for Edge Connectors
Adding Indium Corporation's Solder Fortification to edge connectors within mobile devices improves reliability by strengthening the solder joint....
Create Healthier & Stronger…Solder Joints
Apply Solder Fortification preforms to strengthen solder joints and improve reliability....
Pros and Cons of Convection Reflow Soldering using Nitrogen
Electronics manufacturers who have considered implementing nitrogen in their soldering process know the largest obstacle is cost. Let's explore....
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electroni...