Indium Blog

Solder Spheres for a High Yield Process

  • BGA
  • Indium Corporation
  • Solder
  • Soldering
  • Solder Bumping
  • Solder Defects
  • Solder Spheres
  • Solderability
  • Soldering Products

  • Surprises are rarely a good thing in production.  High quality spheres minimize those ‘surprises’ when building BGAs and CSPs.  ‘Zero defect spheres’ allow you to maintain a continuous build instead of stopping production for clogged sphere chambers, missing spheres, or non-wet failures.






    Microsphere quality is especially important for bumping wafers.  The dimensional tolerance of microspheres impacts the bump co-planarity across a wafer surface.  In short, more precise spheres directly influence the quality of bumps on the die.  This will of course increase your process yield since the spheres will all be closer to the pads they are being soldered to.






    To learn more about precision solder spheres click here.




    Authored by previous Indium Application Manager Jim Hisert