AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design
We can minimize large ground plane solder voiding in electronics assembly by modifying stencil design. ...
Solder Stencils
Handbook of Electronic Assembly Now Available
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...
What is an Intern to Do?
The Indium Corporation has many summer interns this year. The technical support group was fortunate enough to hire Sarah Bjornland (pictured). She is ...
Electronics Assembly Process Optimization Using AuditCoach™
Let’s check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar...
The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...
A Look Inside SMTA Certification with Tim Hults
Indium Corporation’s newest Global Accounts technical service engineer, Tim Hults, recently earned his SMTA Process Certification. Indium Corpor...
To the Windy City and Back Again
This is an account of my trip to Indium’s Chicago facility. If you didn’t get a chance to read my previous post, the link is right he...
A 10 Sigma Solder Paste Printing Process?
Folks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s sm...
SMT Optimization For Success - Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post...
Pin-in-Paste Aperture Calculations Using Solder Preforms with StencilCoach
Folks, As mentioned in the last post, it is a common problem with the PIP (pin-in-paste) process to struggle to get adequate solder volume. If ...
Optimization for Success: Solder Mask Defined vs. Copper Defined Non-Solder Mask Defined) Pads
Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure 1. In the last discussion we statistically evaluated an...
SMTA International 2014 in Retrospect
The plane landed, I got my bags, and I drove home. What a great show. The SMTA International show took place September 28 to October 2 this year in Ro...