Posted On: March 29th, 2022 | By: Dr. Ron Lasky

Interview with Intern Emily Dean

Folks, One of the great advantages of being a professor at Dartmouth College is working with the world’s best young students. However, Emily Dea...

Posted On: March 29th, 2022 | By: Matt Gruber

Optimized QFN Printing Tips

Beware of offset die, i.e. a thermal slug not centered in the device body but offset to the side. and too little solder paste deposited on thermal slu...

Posted On: February 12th, 2016 | By: Christopher Nash

AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Stencil Design

We can minimize large ground plane solder voiding in electronics assembly by modifying stencil design. ...

Posted On: August 24th, 2015 | By: Dr. Ron Lasky

Handbook of Electronic Assembly Now Available

Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...

Posted On: July 24th, 2015 | By: Adam Murling

What is an Intern to Do?

The Indium Corporation has many summer interns this year. The technical support group was fortunate enough to hire Sarah Bjornland (pictured). She is ...

Posted On: February 17th, 2015 | By: Dr. Ron Lasky

Electronics Assembly Process Optimization Using AuditCoach™

Let’s check in on Patty: Mike Madigan was not used to feeling intimidated. After all, as the CEO of ACME, a multi-billion US dollar...

Posted On: January 5th, 2015 | By: Ed Briggs

The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow

In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, espe...

Posted On: December 17th, 2014 | By: Adam Murling

A Look Inside SMTA Certification with Tim Hults

Indium Corporation’s newest Global Accounts technical service engineer, Tim Hults, recently earned his SMTA Process Certification. Indium Corpor...

Posted On: November 24th, 2014 | By: Adam Murling

To the Windy City and Back Again

This is an account of my trip to Indium’s Chicago facility. If you didn’t get a chance to read my previous post, the link is right he...

Posted On: November 21st, 2014 | By: Dr. Ron Lasky

A 10 Sigma Solder Paste Printing Process?

Folks, Let’s check in on Patty as she is about to wrestle with claims of a 10 Sigma Solder Paste Printing Process involving the world’s sm...

Posted On: October 20th, 2014 | By: Ed Briggs

SMT Optimization For Success - Part 6: The Effect of Solder Particle Size on Printing Using Ultrafine Stencil Apertures

SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post...