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Southeast Asia Technical Conference on Electronics Assembly Presentation

I invite you to come to the Southeast Asia Technical Conference on Electronics Assembly in Penang, Malaysia where I will be giving a workshop on SACm®.

My presentation examines the reliability of low-Ag SAC alloys doped with Mn (SACm®) under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.

For more information, or to register,visit http://www.smta.org/education/symposia/symposia.cfm#penang.

Tim