Within the cored wire solder industry, an increasing amount of attention is being given to the amount of spatter created during robotic and hand soldering applications. New products are being introduced to the market with low- or no- spatter listed as one of the first key attributes and marketing materials are being made to supplement this movement.
What is Spatter? Spatter refers to the flakes of flux and solder that spit out from the wire after heat has been applied. It can be caused by the out-gassing of the flux during the soldering process. During automated and manual soldering, spatter is not only cosmetically unappealing but it also increases clean up time, wastes material, can impact sensitive component’s process performance, and can burn the manual soldering operator if they are exposed to the soldering process.
Indium Corporation has been observing the low-spatter trend and through market research has found that spatter does indeed matter. To meet the new needs of the market, Indium has developed two cored wire formulas touting virtually no spatter. The Core 230-RC and CW-808 products contain Indium’s low-spatter technology package and were developed with robotic soldering applications in mind, although spatter does matter in manual soldering as well. To learn more about these products, you can visit our Robotic Soldering webpage.
