Indium Blog

Welcome to the Power Semiconductor Assembly Blog

Welcome to the Power Semiconductor Assembly Blog, Indium Corporation's information watercooler for the Power Semiconductor assembly industry. Some of the topics we will be covering in the coming months are:

-          Pb-free and European legislation in die-attach materials
-          Solder alloy limitations
-          Comparison of die-attach processes
-          Types of component and alloy suitability
-          Failure modes
-          Die-attach wire
-          No-clean and die-attach
-          Halogen-free die-attach and the Green perspective
-          Solder paste life
-          Oxide level measurement and die-attach wire needs
-          Wire-bonding
-          Solder cracking
-          Major control factors in failure modes
-          Thermal conductivity and electrical conductivity

This is your meeting point: let us know how Indium Corporation can help you!