Welcome to the Power Semiconductor Assembly Blog, Indium Corporation's information watercooler for the Power Semiconductor assembly industry. Some of the topics we will be covering in the coming months are:
- Pb-free and European legislation in die-attach materials
- Solder alloy limitations
- Comparison of die-attach processes
- Types of component and alloy suitability
- Failure modes
- Die-attach wire
- No-clean and die-attach
- Halogen-free die-attach and the Green perspective
- Solder paste life
- Oxide level measurement and die-attach wire needs
- Wire-bonding
- Solder cracking
- Major control factors in failure modes
- Thermal conductivity and electrical conductivity
This is your meeting point: let us know how Indium Corporation can help you!