Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. If you clean a piece of steel with HBF4 that has copper dissolved in it, the copper will lightly ‘plate’ onto the steel and passivate it. Copper is much easier to solder to, and typical fluxes should work (otherwise you need a very specialized iron flux). This opens up a world of possibilities for those rusty old steel surfaces.
Related Articles
Innovative Metal Thermal Interface Materials for Bare Die AI GPU Server Processors and ASICs
Innovative Metal TIMs for AI/GPU Processors As artificial intelligence (AI) and high-performance computing (HPC) technologies evolve, their computational demands have skyrocketed, leading to a
Au-mazing Solutions: How AuLTRA® MediPro is at the ‘Heart’ of Implantable Medical Devices
When people think of advancements in medical technology, things like surgery-assisting robots, AI diagnostics, or neurostimulators – like Neuralink’s ‘Blindsight’ –
The Role of Intermetallic Formation and Common Metallization Stack-Ups for Solder TIMs
It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI