Chris Nash is the Product Manager for Indium Corporation’s PCB Assembly Solder Paste. With an intimate understanding of customer needs and challenges, he works closely with the company’s R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. Chris also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers.
Chris joined Indium Corporation in 2005. He has authored several process and technical guidelines and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the occasional IPC standards development committee.
Chris has bachelor’s degree from Clarkson University. He is certified as a Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering and is a Certified SMT Process Engineer.