Dave Saums holds B.S. and MBA degrees from Clarkson University, with post-graduate work at Union College, all in New York. He has forty-three years of work experience in electronics thermal management, working for several manufacturers of thermal materials, CTE-matched composites, and thermal management components and systems. Product areas include military-grade miniature airmoving devices, high-volume commercial airmoving devices, liquid cold plates, heat sinks, thermal interface materials, and CTE-matched thermal composites. He resigned in 2003 as Vice President of Marketing for a specialty thermal composites manufacturer to found DS&A LLC, a consulting firm focused on technical marketing, business strategy, and new product and business development. A presentation given in 2008 in France was the first public implementation and demonstration of a pumped two-phase dielectric liquid cooling system to IGBT modules and a complete electrical drive system; this system concept is now in production for AI servers (2021). Saums has given thermal technology presentations internally at ABB Corporate Research, General Electric Global Research, Hyundai Korea, Hyundai Rotem, Intel, IBM, Infineon Technologies, John Deere, 3M, nVidia, Parker Hannifin, Semikron, and Siemens A&D, and has made hundreds of visits to thermal and mechanical engineering groups globally.
He has served as general chair and presenter for a thermal management workshop in California as a volunteer for twenty-one years, has participated in the organizing committee and presented each year (including twice as keynote) at a European thermal management workshop in France for fifteen years, has served four times as general co-chair for a pan-European thermal management workshop held in Germany and The Netherlands, and is a past program chair and general chair for Semi-Therm, the largest semiconductor thermal management conference. Saums was named a Fellow of the Society by the International Microelectronics and Packaging Society (IMAPS, 2010). He is the founder and general chair of a thermal management workshop for power semiconductors, vehicle electrification, and grid infrastructure (2020, 2021). He has been keynote speaker for a thermal materials workshop (May 2019) and has given tutorials on thermal management and semiconductor thermal materials in an IEEE vehicle powertrain conference in Detroit (June 2019) and a military/aerospace conference (November 2021).