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Video: Driving the Packaging Frontier: Part 1

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Driving the Packaging Frontier: Part 1:

Indium Corporation’s Dr. Andy Mackie, Senior Product Manager, Semiconductor and Advanced Assembly Materials, and Sze Pei Lim, Regional Manager, Semiconductor, discuss how different reliability needs drive packaging trends, including Heterogeneous Integration & Assembly (HIA), SiP, and wafer level packaging.