Applications Thermal Evaporation & PVD Coating

Thermal Evaporation and PVD Coating

Thermal evaporation and physical vapor deposition (PVD) are two techniques used to apply thin films and coatings to various substrates. The purity of the source material is just as crucial as the deposition equipment. Indium Corporation provides high-quality materials, particularly indium and gallium, specifically for the electronics and semiconductor industries. Plus, we offer experienced technical support to help you optimize your PVD process.

Three metallic indium bars with reflective surfaces placed on a dark background.

Achieve High Quality and Efficiency in Thin Film Deposition

Thermal evaporation and PVD are both techniques for thin film deposition, each utilizing different methods. These processes are crucial across various industries, including electronics, automotive, and aerospace. To ensure effective and efficient thermal evaporation, high-purity metals and alloys are essential for achieving quality thin films. Indium Corporation is the preferred choice for customers, thanks to our advanced materials, unwavering commitment to quality, and outstanding technical support.

Elevate Your Thin Film Deposition with Indium Corporation’s Premier Materials and Expertise

Advanced Materials

We take pride in delivering top-tier metals, alloys, and compounds to ensure superior quality in thin film deposition.

Indium Excellence

Indium and its compounds, especially indium tin oxide (ITO), are commonly used in displays, touchscreens, and solar cells because of their exceptional conductivity and transparency.

High-Quality Gallium

Gallium is instrumental in forming gallium arsenide (GaAs), a semiconductor known for its efficiency in converting electricity into light or radio frequency signals, making it essential in LED and radio frequency technology.

Dedicated Services

We work with each customer to choose the right materials and offer our expertise in materials and processes to ensure a seamless experience.

Below is a chart that outlines the types of materials and the forms in which you can get those materials.

MaterialRound ShotTeardrop ShotChunksCustom FormsCrucible FillingCustom Crucible Inserts
InXXXXX
ITOX
GaXX
InGaXXXX

Physical Properties of Common Elements for Thermal Evaporation

IndiumGalliumCopperSelenium
Atomic Number49312934
Boiling Point2072°C2204°C2562°C685°C
Melting Point157°C29.8°C1084°C221°C
Density7.31g/cm³6.10g/cm³8.94g/cm³4.28-4.81g/cm³
Atomic Weight114.8g/mol69.7g/mol63.5g/mol789.6g/mol

Physical Properties for Common Alloys for Thermal Evaporation

ITOCuGaCuln
Melting Point1500°C460°C575°C
Density7.16g/cm³7.91g/cm³8.45g/cm³

Related Applications

A thermal image of an electronic circuit board showing areas of varying heat, with bright orange and yellow indicating hot spots and cooler areas in purple and blue.

Burn-in & Test

Burn-in test solutions with soft metal alloys for improved

Illustration of a microchip with a transparent overlay, revealing internal components and electronic connections, highlighting the precision akin to a tim1 40 design.

TIM1, TIM1.5, TIM2

Metal-based TIMs deliver high thermal performance and

Close-up of a microchip with a thermal pad layered on top, placed on a circuit board.

Immersion Cooling

A technique on the rise for thermal

Related Markets

These methods and materials are used in a variety of markets such as automotive, aerospace, and consumer electronics.