Jim Hisert at Semicon West 2008

It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI

In our previous guide, we introduced the world of low-temperature soldering and its growing importance in modern electronics assembly. Now, we will take a deeper dive into one of the key enabling

In electronics assembly, the soldering process is fundamental to creating reliable connections. Traditionally, this involves high reflow temperatures, often exceeding 240°C. However, as components