Metals
Tin
Indium Corporation is a global leader in high-purity tin and tin-based alloys and compounds. With unmatched expertise in sourcing, processing, and manufacturing, we deliver reliable and efficient solutions to meet the diverse needs of each customer.
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- High Purity From 3N to 6N
- Decades of Experience
Product Overview
Wide Portfolio
Our tin products are designed for industrial use with purity levels from 3N5 to 6N. We provide ingots and shots in different sizes and shapes for versatile applications. And our high-purity offerings meet strict requirements for tasks like tin plating, e-beam evaporation, and EUV plasma generation.
Quality Assurance
Backed by a robust quality management system, our tin products adhere to stringent quality standards, guaranteeing compliance with precise material property criteria. Expect superior quality with ultra-low bulk oxygen content and minimal surface oxide thickness.
Typical Impurities
Due to its ductility, malleability, and electronic properties, tin is widely utilized in the electronics industry, frequently in alloy form. Pure tin provides the optimal plasma spectrum for EUV generation in the semiconductor sector.
Features
With a melting point of 231.93°C (449.47°F) and its corrosion-resistant nature, tin—especially high-purity Tin (3N5 to 6N)—is becoming increasingly popular for a variety of new and innovative applications, including aerospace and semiconductors.
3N5 to 6N
Wide purity levels to meet different needs
99.9999%
Our high-purity tin can meet 6N requirements
Available Physical Forms of Tin (Sn):
Indium Corporation offers a one-source solution for tin with purity levels of up to 99.9999% (6N) in a variety of physical forms. We expertly source crude tin and convert it into the specific shapes and geometries required for your application.
Available Physical Forms
- Ingot
- Shot
- Powder
- Customer fabrications (sphere, wire, tubing, and more)
Grades Available
- 3N5
- 4N
- 4N8
- 5N
- 6N
Tin (Sn) Physical Properties
| Property | Value |
|---|---|
| Atomic Weight | 118.71 |
| Melting Point | 505.08 K (231.93°C or 449.47°F) |
| Boiling Point | 2875 K (2602°C or 4715°F) |
| Density | 7.29 g/cm³ (β tin), 5.77 g/cm³ (α tin), 6.97 g/cm³ (liquid at MP) |
| Phase at Room Temperature | Solid |
| Vapor Pressure | 986 x 10⁻⁶ Pa at 1000°C |
| Surface Tension | 544 mN/m at MP |
| Viscosity at Melting Point | 1.85 m·Pa (cP) |
| Specific Heat @ 20°C | 222 J/(kg·K) |
| Latent Heat of Fusion | 14.2 cal/g |
| Thermal Conductivity @ 20°C | 65 W/(m·K) |
| Coefficient of Linear Expansion | 19.9 x 10⁻⁶ at 0°C |
| Shrinkage on Solidification | 2.80% |
| Volume Conductivity | 15 IACS |
| Brinell Hardness @ 20°C | 3.9 (10kg, 5mm, 180s) |
| Tensile Strength @ 15°C | 2100 psi |
| Latent Heat of Vaporization | 520 +/- 20 cal/g |
Tin Products
Tin is extensively utilized as the cornerstone material in the electronics assembly industry.
High-Purity Tin
High purity tin for advanced applications and reliable
Product Data Sheets
Commercial Tin Metal PDS 98803 (A4) R0.pdf
Commercial Tin Metal PDS 98803 R0.pdf
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