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Advanced Packaging Week (Day 3)

Through-wafer Inspection for MEMS Devices – a Comparison” is the second feature article from the last edition of Advanced Packaging Magazine. In this article, Axel Eschenburg and Taufiq Habib of Viscom AG discuss using near-infrared light to inspect wafer-to-wafer bonding, as opposed to acoustic imaging, long-wave, or x-ray.