Blog

As the future approaches, more and more technologies are discovered. These technologies require some sort of power to activate them. With the increasing need for more energy, a clean, renewable

Hello, My name is John Tomaszewski and I am a Mechanical Engineering major with a minor in Mathematics at Clarkson University. This fall I will be a senior looking to complete my last year and hoping

My name is Tom Donovan and I'm going to be a sophmore at Clarkson University studying Engineering and Management. I was aware of Indium Corporation's intern program and I heard good things

My name is Kim Flanagan and this is my first internship with Indium Corporation. I am the Quality Engineering Intern at the company's BPD facility and, so far, Indium has been a much better

Hi everyone! My name is Lindsay Cannistra and I will be a senior at Clarkson University, studying chemical engineering. I am the engineered solders intern and my supervisor is Tim

My name is Matthew D. Haddad, I am a Desktop Administrator intern here at the Indium Corporation. I work in the Information Technology (IT) department with a great group of people. I am currently

Hello Everyone, I’ll start by giving myself a very quick introduction. My name is Jamie Schwab and I am a senior at Clarkson University where I am majoring in chemical and biomolecular

This video is for manufacturers utilizing indium acetate in their processes. It will cover growing uses and Indium Corporation's processes to ensure consistent quality. Keywords: Phil Zarrow,

Phil Zarrow: This video is for anyone looking for a way to Avoid the Void™ using cored wire, including causes of voiding, and the properties of Indium Corporation's wire that minimize this

Phil Zarrow: This video is for anyone looking for a way to Avoid the Void™ using cored wire, including causes of voiding and the properties of Indium Corporation's wire that minimize this

Phil Zarrow: This video is for anyone interested in the flux challenges with regard to flip-chip/BGA balling. Andy, with regard to flip-chip/BGA balling, what are some of the challenges for the flux?

Phil Zarrow: This video is for anyone interested in the solderability challenges of flip-chip/BGA balling. Andy, solderability is a challenge for the flip-chip/BGA. Can you describe the challenges of

Phil Zarrow: This video is for anyone interested in the halogen-free issues of BGA/flip-chip balling. Andy, halogen-free is an issue that just doesn't seem to go away. Andy C. Mackie, PhD MSc:

Hello, As this internship progresses I will be posting on my experience and documenting my progress, so it is prudent that I first introduce

Hello, my name is John Russo and I’m currently a student at SUNY Polytechnic working diligently to get a bachelor’s degree in Mechanical Engineering Tech. I’m involved in many

First off, I would like to say how grateful I am to be an intern here at the Indium Corporation. This is a great oppurtunity and I look forward to learning many things. I was born and raised in

Dear Future Interns, Hello! My name is Lucia Forte. I am the Marketing Communications (also known as Marcom) intern at Indium Corporation. I am currently studying New Media Marketing at Rochester

Patty was walking to her office as she saw Professor Ulf Gabrielson pass by. "What an impressive older gent, " she thought. He had been a contender for a Nobel Prize a few decades ago and

Indium Corporation's Tim Jensen discusses voiding under QFN components, and how it is a significant challenge in the industry, especially for the thermal pad. Keywords: Voiding, Tim Jensen, QFN

Go to any TV showroom and look at the amazing TV sets that are on display. If you are old enough to remember the old glass tubes, or even if you grew up with nothing but Flat Panel Displays, you

Folks, Looks like Patty and Rob are on another adventure. Let's look in….. Patty had been driving the same 2001 Saab station wagon since college. It had been a great car, but, with almost