Time is precious, and some alloys take their precious time to form intermetallics. For lower melting point alloys, quick wetting doesn’t mean an appropriate amount of intermetallics have formed to bond the solder optimally. Time above liquidus may need to be extended as long as 5 minutes to allow very low temperature alloys a chance to dissolve a surface finish and form intermetallics.
Intermetallic Growth
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
