Welcome to the Power Semiconductor Assembly Blog, Indium Corporation's information watercooler for the Power Semiconductor assembly industry. Some of the topics we will be covering in the coming months are:
– Pb-free and European legislation in die-attach materials
– Solder alloy limitations
– Comparison of die-attach processes
– Types of component and alloy suitability
– Failure modes
– Die-attach wire
– No-clean and die-attach
– Halogen-free die-attach and the Green perspective
– Solder paste life
– Oxide level measurement and die-attach wire needs
– Wire-bonding
– Solder cracking
– Major control factors in failure modes
– Thermal conductivity and electrical conductivity
This is your meeting point: let us know how Indium Corporation can help you!
