Press Releases

Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the industry-leading Indium8.9HF chemistry. It features exceptional low-voiding performance while

Indium Corporation R&D Manager, Alloy Group Dr. HongWen Zhang is scheduled to deliver a presentation at the 73rd Electronic Components and Technology Conference (ECTC),

Solder Chemistry, an Indium Corporation company, will feature its proven solder paste solutions as part of the prestigious Fraunhofer Future Packaging production line

Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the India Electronics and Semiconductor Association (IESA).  Through its

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, May

The next episode of Indium Corporations free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of

Indium Corporation has earned Electronics Manufacturing (EM) World‘s Innovation Award for SiPaste C201HF, a halogen-free, cleanable solder paste specifically formulated to

Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Center for Power Electronics (ECPE), the leading industrial and

Indium Corporation is pleased to announce that Toms Paulos has joined the company as an Assistant Global Accounts Manager.  Paulos is responsible for assisting with the management

Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability. Indalloy303, also

Indium Corporation‘s senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics

Indium Corporation is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge

Indium Corporation‘s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto,

Following a successful inaugural season which included six episodes and five high-profile guests from the EV industry, Indium Corporation‘s EV InSIDER Live webcast series is set

As one of the industry’s foremost providers of Au-based products, Indium Corporation will proudly feature its high-temperature and high-reliability gold solder solutions

Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.   The arrival of

Indium Corporation‘s Brian O’Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in

Indium Corporation‘s Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of

Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous