Reflow Soldering with Formic Acid

Formic acid is a carboxylic acid with the chemical formula HCOOH. When heated to temperatures ≥ 180oC, formic acid “activates” to become a very efficient reducing agent of metal oxides. When formic acid is utilized in reflow soldering, a flux is no longer necessary. Formic acid reflow with the addition of vacuum ensures a true no-clean process with ultra-low voiding and reduced environmental impact compared to traditional reflow soldering thanks to the removal of the cleaning step and the associated waste produced.


Innovative Material for Critical Applications

Virtually Zero Residue

After reflow, almost all of the material is evaporated off, leaving only a clean solder joint.

No Cleaning Necessary

Reduced chemical costs and fewer process steps help contribute to sustainability goals.

Enhanced Compatibility

No residue means no compatibility concerns about flux residue compatibility with underfill or molding materials.

Eliminate Electrochemical Migration

Only benign chemicals that fully evaporate are used, eliminating the risk of ECM.

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