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Heat-Spring™ Customer Case Study – LASER Diode Application

Case studies or product reviews typically provide a good indication that a product is worth purchasing.Recently, one customer (whose name I am purposely excluding) provided me some feedback worth sharing following their evaluation of pure indium Heat-Springs™. The Heat-Spring™ was to be used in a LASER mounting application to a heat sinkwith limited workspace.Competitor materials had been evaluated already, but the resistance of these made the interface temperature too hot.Pure indium Heat-Springs™ were the next evaluation material.

In addition to the thermal benefits of this material, the customer realized some mechanical benefits as well.

He said, "Handling the Heat-Spring™ material is 10-100 times easier from a fragility point of view [compared with previously evaluated materials], especially in the tight space of our configuration."The Heat-Spring™ can be handled as a small foil with tweezes or a suction tip and placed cleanly into location.

The Heat-Spring™ is then clamped down to make tight interfacial contact.The LASER customer noted, "Getting consistent results seemed much more straight forward when clamping the material down [compared with other thermal materials including regular indium foils]. I could actually feel the pieces compress as I tightened the screws."

For further information on using the Heat-Spring™ in applications similar to this LASER diode case study, please feel free to contact me.