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(Follows this post) In most cases, all that is needed is about a 25um layer of flux on the bonding surfaces and solder – usually 2-4% mass of the solder. Flux should almost never be of equal

Folks, Two weeks passed quickly and The Professor returned to ACME. Patty met him at the door. “Professor, it’s great to see you,” Patty said with enthusiasm. “We collected

In my opinion, microsphere bumping is the best combination of cost, simplicity, and precision for bumping. Wafer level packaging shifts some of the common assembly house steps back to the wafer

It's not B2B (it is B2C), but it IS Marcom – and it depicts a clearly successful individual. In other words, listen up and learn – maybe even become inspired. Then, apply it all to

Folks, Business was good at ACME. Even in these challenging times, the company's three assemblylines could not keep up with demand.John, themanger of the assembly lines, decided to request the

A lot has changed in the world of package-on-package in the last few years. The most obvious change that I have seen is the development of specialized pastes for component

Various assemblies utilize solders, including Au/Sn and tin solder, for thermal attachments.These solders perform multiple functions: 1) As a metal interface, they are thermally conductive and will

In previous posts, we have mentioned soldering to gold, but never discussed the unique processing aspects related to this. Soldering to copper is straight-forward.It is done all the time and the

Folks, An effective process engineer will be good at statistically thinking.This skill will help her to quickly recognize and address changes in the manufacturing processes she is responsible

Drilling intowhat's happening with European ELV legislation and how US stakeholders are reacting has been an interesting

The answer is, "no". Let's get that right out of the way up front. Magazines are NOT dead. Not across the board,

If you're new to PV module assembly (tabbing in particular), you're probably trying to get a feel for all the needed materials. This part is a little like getting all the materials you need

It’s no secret that I love WS3622. The water soluble flux is a magic bullet for all types of semiconductor packaging applications. As a tech guy, you need to be able to trust a flux – I

"Hey, Andy!!" The stranger grinned. "Nice to meet you in the flesh at last!". It was the last customer visit on a recent trip to the West Coast, and I was rather surprised by the

Soldering to non-metallics is of interest in numerous applications. Bonding to crystal, ceramic or glass is requested commonly. One of the best materials for doing this is indium and only one basic

Folks, Suppose you need to select a consultant or verify the qualifications of some of your staff to perform designed experiments (DOE), statistical process control (SPC) and statistical

Thermal Profile of Alabama. Source: Worldbook Encyclopedia The program details are coming together for this event coming up in Huntsville, Alabama and the presentations are going to include some

Shhhh. Don't tell anyone but I have a secret. The activators used in halogen-free solder pastes aren't as effective as their halogen contained counterparts. The real secret is coming up with

I’ve always thought that the “nickel felt applicator” needs some explaining.…And a picture.…Heck, why not just get a video of the darn thing in action – right?Well, that’s what we

Sick of trying to find “off the shelf” solder spheres to fit your application? We make microspheres on a per-order basis to your specifications. If you have had trouble getting exactly

Along with my fellow engineer, Eric Bastow, I will be hosting a technical symposium on TIM materials, discussing their purpose, commercial options, performance data of each, and high end applications