Um especialista da Indium Corporation irá apresentar soluções de embalagem para IA e de consumo de alta potência na SEMICON Taiwan

CLINTON, N.Y., August 28, 2026 — Indium Corporation^® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.

The presentation, titled Material Solutions for AI Industry from Packaging to System Assembly, introduces specialized materials designed to overcome these challenges and support better AI performance. Solutions presented include high-performance flux materials for microbump wafer bumping and Chip-on-Wafer (CoW) processes. Also highlighted are mid-temperature solder pastes developed to eliminate Head-in-Pillow (HiP) and Non-Wet-Open (NWO) defects, as well as high-performance thermal interface materials (TIMs) designed to significantly enhance the thermal efficiency of high-performance computing chips.

Jason Chou is a senior area technical manager based at Indium Corporation’s Taiwan facility. In this role, he provides technical support to Indium Corporation’s customers focusing on the semiconductor industry. His strategic location in southern Taiwan enables timely customer response, as well as efficient sales and marketing team support. He holds a bachelor’s degree in chemistry from National Cheng Kung University, Taiwan, and a master’s degree in chemistry from National Tsing Hua University, Taiwan.

SEMICON Taiwan visitors can attend Chou’s presentation on September 4, 13:20-13:40 CST. To learn more about Indium Corporation’s TIMs and HPC materials solutions, visit indium.com or meet with our experts at SEMICON Taiwan, Booth 12416.

Sobre a Indium Corporation

^A Indium^{Corporation®} é uma empresa líder na refinação, fundição, fabrico e fornecimento de materiais para os mercados globais de eletrónica, semicondutores, películas finas e gestão térmica. Os produtos incluem soldas e fluxos; ligas de brasagem; materiais de interface térmica; alvos de pulverização catódica; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e^NanoFoil®. Fundada em 1934, a empresa dispõe de apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, México, Singapura, Coreia do Sul, Reino Unido e EUA.

Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To^Another® (#FOETA), em www.linkedin.com/company/indium-corporation/.