CLINTON, N.Y., August 28, 2026 — Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.
The presentation, titled Material Solutions for AI Industry from Packaging to System Assembly, introduces specialized materials designed to overcome these challenges and support better AI performance. Solutions presented include high-performance flux materials for microbump wafer bumping and Chip-on-Wafer (CoW) processes. Also highlighted are mid-temperature solder pastes developed to eliminate Head-in-Pillow (HiP) and Non-Wet-Open (NWO) defects, as well as high-performance thermal interface materials (TIMs) designed to significantly enhance the thermal efficiency of high-performance computing chips.
Jason Chou is a senior area technical manager based at Indium Corporation’s Taiwan facility. In this role, he provides technical support to Indium Corporation’s customers focusing on the semiconductor industry. His strategic location in southern Taiwan enables timely customer response, as well as efficient sales and marketing team support. He holds a bachelor’s degree in chemistry from National Cheng Kung University, Taiwan, and a master’s degree in chemistry from National Tsing Hua University, Taiwan.
SEMICON Taiwan visitors can attend Chou’s presentation on September 4, 13:20-13:40 CST. To learn more about Indium Corporation’s TIMs and HPC materials solutions, visit indium.com or meet with our experts at SEMICON Taiwan, Booth 12416.
Acerca de Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Mexico, Singapore, South Korea, the United Kingdom, and the U.S.
Para obtener más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer ToAnother® (#FOETA), en www.linkedin.com/company/indium-corporation/.
