CLINTON, N.Y., August 28, 2026 — Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.
The presentation, titled Material Solutions for AI Industry from Packaging to System Assembly, introduces specialized materials designed to overcome these challenges and support better AI performance. Solutions presented include high-performance flux materials for microbump wafer bumping and Chip-on-Wafer (CoW) processes. Also highlighted are mid-temperature solder pastes developed to eliminate Head-in-Pillow (HiP) and Non-Wet-Open (NWO) defects, as well as high-performance thermal interface materials (TIMs) designed to significantly enhance the thermal efficiency of high-performance computing chips.
Jason Chou is a senior area technical manager based at Indium Corporation’s Taiwan facility. In this role, he provides technical support to Indium Corporation’s customers focusing on the semiconductor industry. His strategic location in southern Taiwan enables timely customer response, as well as efficient sales and marketing team support. He holds a bachelor’s degree in chemistry from National Cheng Kung University, Taiwan, and a master’s degree in chemistry from National Tsing Hua University, Taiwan.
SEMICON Taiwan visitors can attend Chou’s presentation on September 4, 13:20-13:40 CST. To learn more about Indium Corporation’s TIMs and HPC materials solutions, visit indium.com or meet with our experts at SEMICON Taiwan, Booth 12416.
關於 Indium Corporation
IndiumCorporation®是全球電子、半導體、薄膜及熱管理市場中首屈一指的材料精煉商、冶煉商、製造商及供應商。 產品涵蓋焊料與助焊劑、釬料、熱界面材料、濺鍍靶材、銦、鎵、鍺及錫等金屬與無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球技術支援網絡，並在中國、德國、印度、馬來西亞、墨西哥、新加坡、南韓、英國及美國設有工廠。
如需了解更多關於 Indium Corporation 的資訊，請造訪www.indium.com或發送電子郵件至[email protected]。您也可以在www.linkedin.com/company/indium-corporation/ 上追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
