Indium Corporation‘s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized with Surface Mount Technology Association (SMTA) China South’s Best Paper of TC2 Technical Conference at NEPCON Shenzhen, 2010.
Dr. Lee’s paper, Testing and Prevention of Head-in-Pillow, includes information on test and development of solder paste materials with excessive resistance against head-in-pillow, as well as approaches for the prevention of this defect.
O Dr. Lee é um especialista em soldadura de renome mundial e um Membro de Distinção da SMTA. Tem uma vasta experiência no desenvolvimento de polímeros de alta temperatura, encapsulantes para microeletrónica, subenchimentos e adesivos. Os seus actuais interesses de investigação abrangem materiais avançados para interconexões e embalagens para aplicações electrónicas e optoelectrónicas, com ênfase tanto no elevado desempenho como no baixo custo de propriedade. O Dr. Lee reside em Clinton, NY.
The SMTA membership is an international network of professionals who build skills, share practical experience, and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
For more information, visit www.smta.org.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
