Indium Corporation‘s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized with Surface Mount Technology Association (SMTA) China South’s Best Paper of TC2 Technical Conference at NEPCON Shenzhen, 2010.
Dr. Lee’s paper, Testing and Prevention of Head-in-Pillow, includes information on test and development of solder paste materials with excessive resistance against head-in-pillow, as well as approaches for the prevention of this defect.
Lee 博士是世界知名的焊接專家，也是 SMTA 的優秀會員。他在高溫聚合物、微電子封裝材料、底部填充物和粘合劑的開發方面擁有豐富的經驗。他目前的研究興趣涵蓋電子和光電應用的先進互連和封裝材料，著重於高效能和低成本。Lee 博士居住在紐約州克林頓。
The SMTA membership is an international network of professionals who build skills, share practical experience, and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
For more information, visit www.smta.org.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型 品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
