Indium Corporation‘s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized with Surface Mount Technology Association (SMTA) China South’s Best Paper of TC2 Technical Conference at NEPCON Shenzhen, 2010.
Dr. Lee’s paper, Testing and Prevention of Head-in-Pillow, includes information on test and development of solder paste materials with excessive resistance against head-in-pillow, as well as approaches for the prevention of this defect.
이 박사는 세계적으로 유명한 납땜 전문가이자 SMTA 우수 회원입니다. 그는 고온 폴리머, 마이크로일렉트로닉스용 인캡슐런트, 언더필 및 접착제 개발 분야에서 폭넓은 경험을 보유하고 있습니다. 현재 그의 연구 관심 분야는 전자 및 광전자 애플리케이션을 위한 인터커넥트 및 패키징용 첨단 소재이며, 고성능과 낮은 소유 비용에 중점을 두고 있습니다. 이 박사는 뉴욕주 클린턴에 거주하고 있습니다.
The SMTA membership is an international network of professionals who build skills, share practical experience, and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
For more information, visit www.smta.org.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는 indiumstg.wpenginepowered.com을 방문하거나 [email protected]으로 이메일을 보내 주시기 바랍니다.
