Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC), Oct. 23-25, in San Jose, California.
Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billion, front-end module SiP devices manufactured in the last three years.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA applications:
- 3D logic/memory and flip-chip:
- Wafer bumping (bump fusion) fluxes
- Flip-chip flux
- Lidded MEMS:
- Dispensable fine-pitch solder paste
- System-in-package:
- Wafer level ball-attach flux
- Ultrafine-pitch solder paste
- Ball grid array
- Ball-attach flux
See our experts at booth #46 or visit our HIA page at indiumstg.wpenginepowered.com/HIA to learn more.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
