Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC), Oct. 23-25, in San Jose, California.
Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billion, front-end module SiP devices manufactured in the last three years.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA applications:
- 3D logic/memory and flip-chip:
- Wafer bumping (bump fusion) fluxes
- Flip-chip flux
- Lidded MEMS:
- Dispensable fine-pitch solder paste
- System-in-package:
- Wafer level ball-attach flux
- Ultrafine-pitch solder paste
- Ball grid array
- Ball-attach flux
See our experts at booth #46 or visit our HIA page at indiumstg.wpenginepowered.com/HIA to learn more.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
