Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC), Oct. 23-25, in San Jose, California.
Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billion, front-end module SiP devices manufactured in the last three years.
From water-soluble to no-clean soldering solutions, Indium Corporation’s portfolio of products meets current and evolving challenges encountered in fine-pitch HIA applications:
- 3D logic/memory and flip-chip:
- Wafer bumping (bump fusion) fluxes
- Flip-chip flux
- Lidded MEMS:
- Dispensable fine-pitch solder paste
- System-in-package:
- Wafer level ball-attach flux
- Ultrafine-pitch solder paste
- Ball grid array
- Ball-attach flux
See our experts at booth #46 or visit our HIA page at indiumstg.wpenginepowered.com/HIA to learn more.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
