Thermal Interface Materials
The dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. Indium Corporation is a leader in the development of both solder and metal-based thermal interface materials (TIM) for a wide variety of applications.
All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials. Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. Its ductility and thermal conductivity make it ideal as a compressible thermal interface material.
The Heat-Spring product has a pattern that improves the contact between two surfaces to dissipate the heat from the generating device to the heat sink.
HSMF and HSMF-OS
HSMF and HSMF-OS are non-silicon based polymer materials that can be used in less demanding thermal conditions.
Since metals are the best conductors of heat, Indium Corporation has a wide range of solders that can be reflowed for attachment and also provide good thermal conductivity.
Thermal Interface Materials Products
Thermal Interface Materials Technical Documents
No presentations to display
Safety Data Sheets
Thermal Interface Materials Blog Posts
Here are three interesting things that I'm predicting will happen with indium in 2019.
In this video, Indium Corporation’s Kay Parker, Technical Support Engineer, demonstrates how to remove the release liners from HSMF thermal interface materials (TIMs)
Indium Corporation presents paper at Advanced Technology Workshop that provdes metal thermal interface materials (TIMs) have a higher insertion rate and higher thermal conductivity than traditional TIMs for burn-in and test.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.