Thermal Interface Materials
The dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. Indium Corporation is a leader in the development of both solder and metal-based thermal interface materials (TIM) for a wide variety of applications.
All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials. Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. Its ductility and thermal conductivity make it ideal as a compressible thermal interface material.
The Heat-Spring product has a pattern that improves the contact between two surfaces to dissipate the heat from the generating device to the heat sink.
The m2TIM™ is a unique solid/liquid hybrid thermal interface material that combines liquid metal with a solid metal preform to provide reliable thermal conductivity while eliminating the need for a solderable surface.
HSMF and HSMF-OS
HSMF is a compressible thermal interface materials made of a non-silicone-based polymer. It is ideal for large area thermal interface requirements, such as IGBTs, which can benefit from the 0.010” thickness. It is also helpful for die-cast heat-sinks with poor planarity. Assembly is efficient as this material has an inherent adhesive property on both sides that allow for easy placement.
HSMF-OS is ideal for burn-in applications due to its reliability and ease of use. It has adhesive properties on just one side that allow for hand placement, removing the need for additional steps and fixtures. HSMF-OS is designed for high-insertion capability. Its tensile strength of ~90MPa and soft compliant polymer backing provides a configuration with “designed in” insertion survivability.
Since metals are the best conductors of heat, Indium Corporation has a wide range of solders that can be reflowed for attachment and also provide good thermal conductivity.
Liquid Metal Thermal Interface Material Innovations for High-Performance Devices
To learn more about liquid metal thermal interface material innovations, check out Tim Jensen's ThermalLIVE presentation on demand.
Thermal Interface Materials Products
Thermal Interface Materials Technical Documents
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Product Data Sheets
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Safety Data Sheets
Thermal Interface Materials Blog Posts
Indium Corporation's Technical Support Engineers are often involved with different projects and departments on a daily basis. All these get us closer to our goal - to ensure our customers WIN!
Why does indium metal play such an important role in so many cutting edge technologies? Tune into Part 1 of the AZO Materials interview with Carol Gowans.
Indium Corporation features metal thermal interface materials for burn-in & test at TestConX (formerly BiTS). Find out why these materials are in such demand.
From One Engineer to Another®
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