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Die-attach Stresses

Soft solders are used instead of hard solders in applications were there are large coefficient of thermal expansion mismatches between semiconductor die and leadframes. A hard solder can cause die

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The Thermal Team on Tour

Can't get enough of us? Members of Indium's thermal management team will be attending MEPTEC's 4th Annual Thermal Management symposium titled "The Heat Is On: Thermal Technology

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Consider Solder Spheres

Spheres are a great solder form for prototype work. (Pictured here are a range of sphere sizes, BGA size compared to flip chip size.) Solder spheres are most commonly used for package-level and

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I Make House Calls

If you need me to troubleshoot your ball attach process, PoP process, flip-chip assembly process, or die-attach process, I’d be happy to come and visit. Even if there is no immediate problems, I

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Flip Chip Epoxy Flux

Just in case you haven’t heard of epoxy flux yet, let me fill you in. Epoxy flux is what I call a “super no-clean” flux. A no-clean flux is designed to entrap unused activator in a semi-solid

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Design Options for Metal Thermal Interface Materials in LEDs

With the Strategies in Light show just behind us, I thought it a good time to discuss a little further the use of metal thermal interface materials in high power LEDs. I have not met a designer yet

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Indium Corporation Wall Chart

Do you have a 2' x 3' area on the wall of your office or cubical for the latest new and improved Indium Corporation Wall Chart? Click here to email us your name and address so we can send you

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Solder Mask Controls Interconnects

The shape of your solder joint below a flip-chip or BGA is controlled by the surface tension of the alloy, the activity of flux used, the tension or compression on the component during reflow, as

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Circuitnet Performs Lead-Free Usage Poll: About 40% of Respondent’s Lines are Lead-Free

Folks, The team at Circuitnet has performed a poll on lead-free line usage. They asked the question: As we enter 2008, what percentage of your production lines are running lead-free? The resulting

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What to Expect When Stencil Printing Flux

Stencil printing flux is easy if you know what to expect before attempting it. It is easier than stencil printing solder paste in most common aperture ratio (.66) situations, although both large

Archive

Why Thin-Film Solar Cells are Here to Stay

Apart from independence from silicon, thin-film solar cells have several advantages. On perfect day and perfect conditions crystalline silicon solar cells would out-perform thin-film solar cells in

Internship

How We Fell In Love

Okay, I’ll be honest – I think it’s pretty cheesy to write an entry on Valentines Day regarding my passion for the industry. I will, however, take some time to comment on how I came

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Ball Attach Surface Finishes

Just incase you were wondering, here are the wetting results you can expect when soldering Pb-free spheres to different surface finishes. The chart shown here is the average result of about 15

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Blogging Is Good (part 4,326,861,699)

As if you need any more support for blogging in your B2B practice. "With Yahoo and Google consistently ranked the No. 1 and No. 2 most frequently viewed sites on the Web (comScore said Yahoo had

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Soldering Basics

A couple of my colleagues, Jim Hisert and Andy Mackie recently published an article about the use of solders in chip packaging. The article begins with the historical notion that the practice of

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Variables in Testing

It’s easy to have a test matrix escalate into a black hole of time, effort, and money

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Ancient Text

I love to read white papers from the 1930’s on indium (the element). People had no idea what interesting properties they would discover from working with this strange and fascinating metal. We

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Interest in Metal Alloy Density Calculator Still Strong

Folks, I continue to receive regular requests for the Excel spread I developed that calculates alloy densities. We have a new improved (looks more attractive) version I can send to folks that want

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What is Semiconductor Packaging?

I’d say my version of the term is ‘protecting a semiconductor while facilitating its connection to the outside

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Package-on-Package Reflow (5/5)

Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefully us!). A cage should be placed over the

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