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Welcome to the Engineered Solders Blog
Engineered Solders have a long history at Indium. They have been called many things that made sense to us because of the way we made them. But when we stopped to think about the way our customers
Package-on-Package Transport (4/5)
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and
Package-on-Package Placement (3/5)
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-on-Package flux is different, I have not found
Package-on-Package Component Dipping (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by
Do LEDs need pure metal thermal interface materials?
Simply stated, YES. In effort to stay on top of industry technology I spend as much time as I can afford attempting to learn about the current thermal solutions being used on various devices. LEDs
A Method to Attach Indium Interfaces over Large Surface Areas
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a soldered indium interface. A related property of
Package-on-Package Paste Leveling (1/5)
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is important to start with a level reservoir of paste
More B2B Viral Elfing
I recently posted on a cool site that has gone wildly viral."Wildly" = >110,000,000 interactions. Not too shabby. A friend just sent me a very similar tool, this time used
Beginner X-sectioning Tips
Even if you only x-section every now and then, it is easy to develop bad habits. Here are some quick tips to help the novice x-section preparer: 1) Pot your sample with enough epoxy that you can
Newest Video Ad: CARBON FOOTPRINT
Indium Corporation manufactures a wide array of assembly materials. One of the arenas we are involved in is SOLAR PHOTOVOLTAIC assembly materials. When developing our advertising for this product
We’re a Lot Closer When You Call
E-mail is easy, and helps clarify requests and information, however talking directly with a Technical Support Engineer or Application Engineer allows an instantaneous flow of
Halide Free Flux Interest Continues
Folks, My colleagues at Indium Corp tell me that some major companies are now starting to specify maximum halogen levels in solder paste flux residues after
Be Creative
Bucket Man is probably my favorite drummer of all time. He puts on a great show, he’s a down-to-earth guy, and he uses what he has around him to create awesome drum
Package-on-Package Spacers
I’m going to let the PoP Interconnect Spacers data sheet do the technical explanation here, but I’ve gotta say these spacers have quite a future ahead of them. The most exiting thing is
Video On Web: “The Ultimate Frontier”?
CREATIVITY Magazine's website offers up an excellent article titled, It's Time To Picture A New Web, written by Gary Shenk, CEO of Corbis. The article touts the pending criticality of online
Au/Sn – One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the
Control Your Materials, or They Will Control You (part 2)
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. While the increase in solder generally improves
Control Your Materials, or They Will Control You (part 1)
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are
The World Needs WEEE/RoHS
Folks, Recently the concern for e-waste has hit the mainstream media. The most thorough article being in National Geographic with supporting articles in US News and World Report, Scientific American
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