Blog

SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the stencil printer. Figure 1 (below) depicts a very busy

Folks, Let's look at Patty's last day of class…… As she was driving north to teach her statistics class, Patty was sad to see her stint at Ivy U come to a close. She was even more

Mọi người ơi, chúng ta hãy cùng xem Patty đang học ở Ivy U như thế nào nhé. Patty sắp kết thúc thời gian giảng dạy tại Ivy U. Chỉ còn vài lớp nữa thôi. Cô ấy phải thừa nhận rằng cô ấy rất buồn khi thấy điều này

Folks, An obvious disadvantage of lead-free assembly is that the oven must be hotter and therefore will use more electricity. But is the extra amount of electricity significant? Bill O’’Leary

Folks, Some time ago I posted on “The Curse of the Early First Fail” and “Interpreting Weibull Plots.” Both of these posts related to using Weibull analysis to make sound engineering

Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recognize ROL0 and ROL1 classified fluxes and solder

I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be

Folks, Let’s see how Patty is doing after teaching her first class at Ivy U… Patty arrived at home after teaching her first class at Ivy U and she couldn’t contain her

My colleagues and I have had several conversations with customers wanting to use indium against an aluminum surface, either for the sake of creating a compression seal or thermal path. A troubling

Folks, Let’s look in on Patty…. Patty was really nervous. As a matter of fact, there was no time she remembered being this nervous. The cause of her nervousness? She was going to teach a

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industry to focus more on the printing process to obtain

Khi ở Đông Nam Á vào mùa hè năm ngoái, nhóm kỹ thuật của Indium và tôi đã có cơ hội thảo luận về quy trình nhúng chip lật bằng một thiết bị lớn

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had

Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The term "solderability"is a way of talking

Mọi người ơi, bài đăng gần đây của tôi về tin râu đã gợi lại ký ức về sâu bọ thiếc trong tâm trí tôi. Tôi phải thừa nhận rằng, với tất cả những lo ngại hợp pháp về độ tin cậy liên quan đến tin râu, tôi ngạc nhiên rằng

Câu hỏi thú vị từ một khách hàng Trung Quốc chuyên về die-attach tuần này hỏi về điện trở suất của chất hàn. Bạn tôi, Eric Bastow, đã gợi ý rằng Indium nên cung cấp thông tin này cho tất cả mọi người thông qua một blog

People use indium in many forms – to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this

Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-free, by definition Beneficial mechanical

Due to its softness and compressibility, indium is ideal for use in creating a seal. Generally 99.99% indium is adequate for a vacuum, hermetic or cryogenic seal, but higher purities are also

Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production