Blog

SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the stencil printer. Figure 1 (below) depicts a very busy

Folks, Let's look at Patty's last day of class…… As she was driving north to teach her statistics class, Patty was sad to see her stint at Ivy U come to a close. She was even more

Gente, facciamo il punto su come se la cava Patty all'Ivy U. Patty si stava avvicinando alla fine del suo periodo di insegnamento all'Ivy U. Rimanevano solo pochi corsi. Doveva ammettere di essere triste nel vedere che questo

Folks, An obvious disadvantage of lead-free assembly is that the oven must be hotter and therefore will use more electricity. But is the extra amount of electricity significant? Bill O’’Leary

Folks, Some time ago I posted on “The Curse of the Early First Fail” and “Interpreting Weibull Plots.” Both of these posts related to using Weibull analysis to make sound engineering

Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recognize ROL0 and ROL1 classified fluxes and solder

I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be

Folks, Let’s see how Patty is doing after teaching her first class at Ivy U… Patty arrived at home after teaching her first class at Ivy U and she couldn’t contain her

My colleagues and I have had several conversations with customers wanting to use indium against an aluminum surface, either for the sake of creating a compression seal or thermal path. A troubling

Folks, Let’s look in on Patty…. Patty was really nervous. As a matter of fact, there was no time she remembered being this nervous. The cause of her nervousness? She was going to teach a

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industry to focus more on the printing process to obtain

L'estate scorsa, mentre ci trovavamo nel Sud-Est asiatico, io e il team tecnico di Indium abbiamo avuto l'opportunità di discutere dei processi di immersione dei flip-chip con un'importante azienda di attrezzature.

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had

Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The term "solderability"is a way of talking

Gente, il mio recente post sui baffi di stagno mi ha fatto tornare in mente il ricordo della peste di stagno. Devo ammettere che, con tutti i legittimi problemi di affidabilità legati ai baffi di stagno, sono sorpreso che

Questa settimana un cliente cinese ha posto una domanda interessante sulla resistività volumetrica delle saldature. Il mio amico, Eric Bastow, ha suggerito a Indium di renderla disponibile a tutti attraverso un blog.

People use indium in many forms – to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this

Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-free, by definition Beneficial mechanical

Due to its softness and compressibility, indium is ideal for use in creating a seal. Generally 99.99% indium is adequate for a vacuum, hermetic or cryogenic seal, but higher purities are also

Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production