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이번 주 중국의 다이 어태치먼트 고객으로부터 땜납의 체적 저항에 대한 흥미로운 질문이 있었습니다. 제 친구인 Eric Bastow가 블로그를 통해 인디엄이 이 정보를 모든 사람에게 제공할 것을 제안했습니다.

People use indium in many forms – to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this

Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-free, by definition Beneficial mechanical

Due to its softness and compressibility, indium is ideal for use in creating a seal. Generally 99.99% indium is adequate for a vacuum, hermetic or cryogenic seal, but higher purities are also

Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production

Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay……. Patty saw a link on one of the daily SMT Tech newsletters that piqued her interest. It was titled, “A New Alloy

모든 금속이 서로 잘 어울리는 것은 아닙니다. 이는 전자제품과 그 안에 사용되는 재료의 세계에도 적용됩니다. 비교적 새롭고 관련성이 높은 사례는 RoHS의 출현과 함께 등장한

Folks, It's been awhile, let's see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She was happy to see Tiger Woods doing better, but a little

Here’s an interesting technology fact I just learned: Indium Sulfide was the very first indium compound to be discovered. I bet Reich and Richter (the discovers of indium) never imagined that

Folks, Let’s see how Patty is doing with her latest challenge….. Patty had decided to call The Professor and see what advice he had to offer in preparation for her visit to the facility

여러분, 패티에게 무슨 일이 있었는지 봅시다........ 패티는 조금 피곤한 듯 컴퓨터 앞에 앉아있었습니다. 그녀는 콜로니얼 윌리엄스버그에서 일주일간의 휴가를 마치고 막 돌아온 뒤였습니다.

웨이퍼 범핑 공정은 지난 10년 동안 발전해 왔습니다. 반도체 조립 산업은 솔더 페이스트 프린팅을 사용하는 범핑 공정에서 보이드에 대한 모든 우려를 안고 있습니다,

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics environment is arguably one of the most thermally

NanoFoil®requires a threshold of energy to activate. What happens if that energy value is not met?: Interdiffusion and inhibition of the NanoBond® reaction. This can happen if NanoFoil®

Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, but did you know that you can solder wooden

Being the Indium Corporation, we know what indium is, where it comes from, and how to use it. But sometimes we forget that not everyone is as immersed in indium as we are. So what is indium? Of

Folks, In the category of interesting requests, Ron, a gold worker, from Guyana, sent me the following note: Dr. Ron, My colleagues use a “wet” gold technique to measure gold alloy

There are many sputtering target materials that are tricky to solder to. For those alloys we ‘bring out the big guns’ – in this case, our ultrasonic soldering

In order to NanoBond® parts that are made out of copper, nickel, or platinum, we must first apply solder to the bonding surface. This is most commonly done by melting solder directly onto the

Folks, Our discussion of Weibull Analysis continues…..Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste,

Sometimes one piece of NanoFoil® just isn’t enough… We often NanoBond® sputtering targets which are large enough to require multiple sheets of NanoFoil® to cover the width or