블로그

SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the stencil printer. Figure 1 (below) depicts a very busy

Folks, Let's look at Patty's last day of class…… As she was driving north to teach her statistics class, Patty was sad to see her stint at Ivy U come to a close. She was even more

여러분, 패티가 아이비 대학에서 어떻게 지내고 있는지 확인해 보겠습니다. 패티는 아이비 대학에서의 강의가 거의 끝나갈 무렵이었고 몇 개의 수업만 더 남아있었습니다. 패티는 슬픔을 감추지 못했습니다.

Folks, An obvious disadvantage of lead-free assembly is that the oven must be hotter and therefore will use more electricity. But is the extra amount of electricity significant? Bill O’’Leary

Folks, Some time ago I posted on “The Curse of the Early First Fail” and “Interpreting Weibull Plots.” Both of these posts related to using Weibull analysis to make sound engineering

Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recognize ROL0 and ROL1 classified fluxes and solder

I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be

Folks, Let’s see how Patty is doing after teaching her first class at Ivy U… Patty arrived at home after teaching her first class at Ivy U and she couldn’t contain her

My colleagues and I have had several conversations with customers wanting to use indium against an aluminum surface, either for the sake of creating a compression seal or thermal path. A troubling

Folks, Let’s look in on Patty…. Patty was really nervous. As a matter of fact, there was no time she remembered being this nervous. The cause of her nervousness? She was going to teach a

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industry to focus more on the printing process to obtain

지난 여름 동남아시아에서 인디엄의 기술팀과 저는 주요 장비와 플립칩 침지 공정에 대해 논의할 기회가 있었습니다.

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had

Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The term "solderability"is a way of talking

여러분, 최근 양철 수염에 대한 저의 포스팅을 보고 양철 해충에 대한 기억이 떠올랐습니다. 양철 수염과 관련된 모든 합법적인 신뢰성 문제를 고려할 때, 저는 다음과 같은 사실에 놀랐습니다.

이번 주 중국의 다이 어태치먼트 고객으로부터 땜납의 체적 저항에 대한 흥미로운 질문이 있었습니다. 제 친구인 Eric Bastow가 블로그를 통해 인디엄이 이 정보를 모든 사람에게 제공할 것을 제안했습니다.

People use indium in many forms – to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this

Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-free, by definition Beneficial mechanical

Due to its softness and compressibility, indium is ideal for use in creating a seal. Generally 99.99% indium is adequate for a vacuum, hermetic or cryogenic seal, but higher purities are also

Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production