Indium Corporations Leo Hu, senior area technical manager East China, will share insights on tool-free solder preform technology for power module assembly during a poster session at PCIM Asia, Sept. 9-11, Shenzhen, China.
In power module manufacturing, emerging performance demands and their impact on module design present reliability challenges, such as increased junction temperatures, current densities, and packaging complexity. Manufacturers are adopting key techniques to achieve reliability, by precisely aligning component distance and tolerance between dies, using high-quality reflow techniques, and avoiding the use of additional flux. Dedicated fixturing systems are being used to maintain alignment during assembly and reflow, but challenges are driving timeline and cost. Based on a presentation developed by Indium Corporations Product Manager ESM/Power Electronics Joe Hertline, Global Account Manager and Senior Thermal Technologist Tim Jensen, and Regional Technical Manager and Technologist Advanced Applications Andreas Karch, and Bond Pulses Dr. Aaron Hutzler, the poster Reducing Design-for-Manufacturing Complexity with Tool-Free Solder Preform Technology for Power Module Assembly will review these challenges and a solutiona novel tacking material technology that enables precise placement without dedicated tooling and fixturing equipment. This material offers robust tackiness, precise and repeatable alignment, and prevents uneven stress distribution and thermal hot spots.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a masters degree in IC engineering from the Chinese Academy of Science and a bachelors degree in electronic information science and technology from Nankai University, Tianjin, China.
Giới thiệu về Indium Corporation
Indium Corporation là một nhà tinh chế vật liệu, nhà luyện kim, nhà sản xuất và nhà cung cấp hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ dung; chất hàn; vật liệu giao diện nhiệt; mục tiêu phun; kim loại indium, gali, germani và thiếc và các hợp chất vô cơ; và NanoFoil . Được thành lập vào năm 1934, công ty có hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Đức, Ấn Độ, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ
Để biết thêm thông tin về Indium Corporation, hãy truy cập www.indium.com hoặc gửi email cho Jingya Huang . Bạn cũng có thể theo dõi các chuyên gia của chúng tôi, Từ kỹ sư này đến kỹ sư khác (#FOETA), tại www.linkedin.com/company/indium-corporation/ hoặc @IndiumCorp .
About PCIM Asia
PCIM Asia, sister event of PCIM Europe in Nuremberg, Germany, offers unique opportunities in one of the fastest growing markets for power electronics. Established in 2002, PCIM Asia is the only specialized exhibition and conference platform in China for power electronics, intelligent motion, renewable energy, and energy management in the Asian market.
