Webinar
1 Kilowatt and Beyond: Indium solder TIMs (sTIMs) for Bare Die Assembly
Save your spot and join us at 2 pm EST | 11 am PST on September 30 to unlock the true potential of AI, gaming, and high-performance computing.
For today’s high-power semiconductor packages, heat is the enemy.
Indium solder TIMs (sTIMs) are your first line of defense to enable the effective dissipation of heat in excess of 1kW per die.
If you’re looking to either select or implement a high-performance TIM into your processor assembly, then you can’t miss our upcoming live webinar. We will explore how indium sTIMs are succeeding where traditional polymeric and graphite TIMs fail.
In this webinar you’ll learn:
How to adopt and implement a solder TIM onto your bare die assembly (TIM1.5)
About the process and design considerations for solder TIMs
Insights into sTIM1.5 design, implementation, and optimization
Inspection, characterization, and reliability assessment methodologies
How Indium Corporation’s global supply chain and material availability cut down the time from design to high-volume production
…and much more!
Featured Speaker
Ryan Mayberry
Senior Application Development Engineer, ESM
Heat Is the Enemy.
sTIMs Are the Solution.
Indium Corporation is your guide.
As the world’s first innovator of sTIM solutions, Indium Corporation brings its 90+ years of materials science expertise to work directly with you. Our team of application engineers and metallurgists will assist in integrating sTIMs into your process.
High Performance
Our sTIMs deliver the lowest total thermal resistance with minimal voiding.
Reliable
We’ll help you design and adopt a package solution that ensures both improved thermal performance and thermo-mechanical reliability.
Manufactured Globally
Our manufacturing capabilities ensure high-quality product availability at scale across the globe.
Sustainable
We source our materials reliably and responsibly and offer reclaim and recycle programs.
Webinar
1 Kilowatt and Beyond: Indium solder TIMs (sTIMs) for Bare Die Assembly
Save your spot and join us at 2 pm EST | 11 am PST on September 30 to unlock the true potential of AI, gaming, and high-performance computing.
