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Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

Here’s a question regarding samples of various alloys. “I am looking for small quantities of 8-10 different alloys to be used for testing at different temperatures. The test simply

Gold-plated surfaces are widely used in electronics assembly. But, using common tin-based solder alloys against these surfaces can scavenge the gold, destroying the gold conduction patterns and

One of the key components of the soldering process is flux.Without the right flux to remove the oxides, you can end up with a poor solder joint. Things only get worse from there. Since our customers

There have been avariety of people who were key to the development of indium metal in general, and Indium Corporation in particular, over the years. People such as: Hieronymus Theodor Richter and

There are a lot of parameters to consider when choosing the right solder for your application: 1) The operational temperature of the final device 2) The metallizations that you are soldering to 3)