Indium Corporation Introduces Liquid Flip-Chip Flux
March 1, 2022
Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.
WS-3910 is a water-soluble, halogen-free flip-chip flux that is designed for low-temperature—150°C—bismuth-tin applications. WS-3910 is chemically designed to exhibit minimal evaporation after application. Its composition also eliminates compatibility underfills by having a completely water-cleanable residue.
WS-3910:
- Features low evaporation after application, offering a more flexible process window than other similar fluxes; it does not dry out during reflow
- Shows strong activity at low temperatures, with a current peak reflow temperature of 150°C, making it ideal for applications where oxide formation is unwanted
- Compatible with spraying applications
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.