Indium Corporation is the leader in metal thermal interface materials (TIMs). All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials. Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. It's ductility and thermal conductivity make it ideal as a compressible thermal interface material. For the thermal K values of other thermally conductive materials, check out our thermal K list.
Metal TIMs can be divided into two categories:
- Solder TIMs that reflow and melt to form a mechanical bond
- Compressible TIMs that serve as gap fillers and do not need heat to form a bond
Solder interconnects can also act as a thermal interface. Indium Corporation makes over 200 different alloys for solder preforms. These alloys can be pure indium, indium alloys, Pb-free, or Pb-contained. Please consult one of our technical support engineers to identify the best metal TIM for your application. Solder TIMs include:
- Solder Preforms
- Flux-Coated Preforms
Compressible (or non-reflow) TIMs include:
- Liquid Metal
Indium Corporation's metal TIMs can be used in the following applications:
- Solder Materials used for Die-Attach
- Re-usable Compressible TIMs for Burn-in and Test
- Solder Materials and Thermal Materials for IGBT Power Devices
- Solder Materials and Thermal Materials for RF Type Devices
- Solder for TIM1, TIM2 and TIM1.5 in Microprocessors
Not Sure? Find your best solution
At Indium Corporation we are interested in solving your problem and giving you a solution. We are a material supplier but more importantly we are a partner. Indium has built its reputation on being the leader in knowledge when it comes to any problem you may be dealing with that involves solder, metal or any assembly process. If you are not sure what would be best, please take a moment to fill out a request form online or download this form. Please review these questions and contact us. If you would like a form emailed to you, please click here to request a copy.
Thermal Management Technical Documents
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