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Thermal Management

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Thermal Management

Indium Corporation is the leader in metal thermal interface materials (TIMs). All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials. Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. It's ductility and thermal conductivity make it ideal as a compressible thermal interface material. For the thermal K values of other thermally conductive materials, check out our thermal K list.

Metal TIMs can be divided into two categories:

  1. Solder TIMs that reflow and melt to form a mechanical bond
  2. Compressible TIMs that serve as gap fillers and do not need heat to form a bond

Solder interconnects can also act as a thermal interface. Indium Corporation makes over 200 different alloys for solder preforms. These alloys can be pure indium, indium alloys, Pb-free, or Pb-contained. Please consult one of our technical support engineers to identify the best metal TIM for your application. Solder TIMs include:

  • Solder Preforms
  • Flux-Coated Preforms

Compressible (or non-reflow) TIMs include:

  • Heat-Springs®
  • Liquid Metal

Indium Corporation's metal TIMs can be used in the following applications:

  • Solder Materials used for Die-Attach
  • Re-usable Compressible TIMs for Burn-in and Test
  • Solder Materials and Thermal Materials for IGBT Power Devices
  • Solder Materials and Thermal Materials for RF Type Devices
  • Solder for TIM1, TIM2 and TIM1.5 in Microprocessors

Not Sure? Find your best solution

At Indium Corporation we are interested in solving your problem and giving you a solution. We are a material supplier but more importantly we are a partner. Indium has built its reputation on being the leader in knowledge when it comes to any problem you may be dealing with that involves solder, metal or any assembly process. If you are not sure what would be best, please take a moment to fill out a request form online or download this form. Please review these questions and contact us. If you would like a form emailed to you, please click here to request a copy.

  • Burn-in and Test
  • Concentrated Photovoltaic
  • IGBT
  • RF Power Devices
  • TIM1, TIM1.5, TIM2

Thermal Management Technical Documents

Whitepapers

Request This Document

Thermal Management Materials Choices

Authors: Andy C. Mackie PhD, Bob Jarrett, Dave Saums, Jordan Ross

Posted on 1 Jul 2009

Application Notes

No application notes to display

Product Data Sheets

Solder Alloy Chart (Letter)

Material Safety Data Sheets

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Thermal Management Blog Posts

Leadframe Solderability Issues in Power Semiconductors

Friday, April 05, 2013 by Dr. Andy Mackie [view bio]

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The "under the hood / bonnet" electronics environment is arguably one of the most thermally stressful environments on the planet. Electronics close to the engine block can experience extremes ranging…

The Magic of Engineered Solders

Friday, April 05, 2013 by Seth Homer [view bio]

Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…

What Is Indium?

Friday, March 15, 2013 by Carol Gowans [view bio]

Being the Indium Corporation, we know what indium is, where it comes from, and how to use it.  But sometimes we forget that not everyone is as immersed in indium as we are. So what is indium?  Of course it is an element with an atomic number of 49, an atomic weight of 114.818amu, a relative…

View All Blog Posts

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Jordan Ross

This page is owned by:

Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com

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