Indium Corporation is the leader in metal thermal interface materials (TIMs). All of our thermal interface materials are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials. Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. It's ductility and thermal conductivity make it ideal as a compressible thermal interface material. For the thermal K values of other thermally conductive materials, check out our thermal K list.
Metal TIMs can be divided into two categories:
- Solder TIMs that reflow and melt to form a mechanical bond
- Compressible TIMs that serve as gap fillers and do not need heat to form a bond
Solder interconnects can also act as a thermal interface. Indium Corporation makes over 200 different alloys for solder preforms. These alloys can be pure indium, indium alloys, Pb-free, or Pb-contained. Please consult one of our technical support engineers to identify the best metal TIM for your application. Solder TIMs include:
- Solder Preforms
- Flux-Coated Preforms
Compressible (or non-reflow) TIMs include:
- Liquid Metal
Indium Corporation's metal TIMs can be used in the following applications:
- Solder Materials used for Die-Attach
- Re-usable Compressible TIMs for Burn-in and Test
- Solder Materials and Thermal Materials for IGBT Power Devices
- Solder Materials and Thermal Materials for RF Type Devices
- Solder for TIM1, TIM2 and TIM1.5 in Microprocessors
Thermal Management Technical Documents
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Thermal Management Blog Posts
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From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.