Indium Blog

Ball Attach Flux for a High Yield Process

If you have been hoping that you current BGA process doesn’t fall victim to non-wets, it’s time to gain confidence.  It sounds like you need a ball attach flux that is powerful.  Those old solderability tests that define a flux’s wetting characteristics are done on clean copper.  If you’re like the rest of the industry, I doubt you are using bare copper pads on your substrates.  We know what works with different alloys on many various surfaces including Au/Sn, OSP, and Nickel (to name a few).  Stop worrying about the flux you are using and give me a call @ (315) 853-4900 x7592.



Authored by previous Indium Application Manager Jim Hisert