Indium Blog

NanoBond® is a Room Temperature Bonding Process

  • Indium Corporation
  • NanoBond®
  • Solder
  • Solder Alloys
  • Soldering
  • Solderability

  • As I mentioned in an earlier post, some soldering applications require a fluxless process. In this line of work you see an assortment of odd soldering requests. Similarly, some soldering applications become tricky because the assembly cannot withstand traditional soldering temperatures.

    In addition to cold welding and solid state diffusion, the NanoBond® process provides another method of creating a bond at room temperature. Unlike cold welding and solid state diffusion, NanoBonds are achievable with traditional solder alloys. (I haven’t found one that doesn’t work yet!) If you have a unique application which is temperature sensitive, please let us know how we can help you.

    Authored by previous Indium Application Manager Jim Hisert