因为我 在前一篇文章中提到的有些焊接应用需要使用无助焊剂工艺。在这一行中，你会看到各种各样奇怪的焊接要求。同样，有些焊接应用也很棘手，因为组件无法承受传统的焊接温度。
除了冷焊和固态扩散，NanoBond®工艺还提供了另一种在室温下形成粘接的方法。与冷焊和固态扩散不同，NanoBonds 可以用传统的焊料合金来实现（我还没有找到一种不可行的焊料合金！）。(我还没有发现一种不可行的方法！）如果您有对温度敏感的独特应用，请让我们知道如何为您提供帮助。
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