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Autonomous Vehicles Even Farther Out in Time

Folks, Readers of this blog will remember that I have been a skeptic of self-driving cars emerging in the near term. I am even less sanguine today. A recent article supports my perspective. Humans

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Metal Loading: Powder Size for Printing and Dispensing

At Indium Corporation, we get a lot of questions about solder paste – its composition, its application, and best practice advice.Many of those questions often involve inquiries aboutthe metal

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Thixotropy: An Important Solder Paste Property

Folks, To the SMT process engineer, the second most important thixotropic material in their lives is solder paste. If solder paste was not thixotropic, it would be difficult to print and would likely

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Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling: Part III

Previously in this blog series,we discussed some of the best practices for attaching thermocouples to a printed circuit board (PCB) for reflow profiling. Today, I will end this series with a few more

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Indium Atoms in Superfluid Helium

While researching new potential applications for indium, I’m generally more interested in the ends than the means. In a departure from that outlook, two related studies have me more interested

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Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling: Part I

In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep best practices for attaching thermocouples in mind. The first thing to remember is that a

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Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling Part II

As discussed in a previous blog post, it is important to followbest practices for attaching thermocouples to a printed circuit board (PCB) toaccurately measure the reflow profile of an assembly.

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Liquid Metal Experimentation with Miloš Lazić (Part 4)

We are back today to finish our conversation with Miloš Lazić. If you missed the first three parts, feel free to jump back to the beginning here. Jim: What interests you about this material

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Liquid Metal Experimentation with Miloš Lazić (Part 3)

Yesterday, in Part 2 ofour interview, Miloš mentioned how using a hybrid solid/liquid TIM provides benefits over thermal grease. Today we discuss the challenges to working with liquid metal,

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Liquid Metal Experimentation with Miloš Lazić (Part 2)

In yesterday’s post, Miloš and I discussed what he’s been working on in the

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Liquid Metal Experimentation with Miloš Lazić (Part 1)

I recently caught up with Miloš Lazić,one of our Technical Support Engineers who has taken a special interest in liquid metals. In the lab, Miloš has been experimenting with and

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Size Does Matter!

Size matters. That statement rings true for many things in life. Alarger vehicle can transport more people, but you may have trouble finding appropriate parking. Aperson with smaller hands can easily

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Trade Names of Low Temperature Alloys

“Low melt alloys” is a term some people use to describe alloys that melt at temperatures lower than more traditional SnPb or SnAgCu alloys. You may have heard of (or perhaps are looking

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Indium Skunk Works

Disclaimer If not knowing all the details about a topic may disturb you, it’s best to skip to a different post. I suggest the following: The Complete Introduction to Pure Indium Preforms Now

Archive

Zarrow and Hall’s “Board Talk” Becomes a Book

Folks, There are a few good books that relate to electronics assembly. Ray Prasad’s Surface Mount Technology: Principles and Practice comes to

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Come Visit Our Brand New Website

Have you had a chance to look at the new Indium Corporation web site?It has a brand new format and some new features that we think you will like! The first feature we have added right on the home

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Engineering Drawing / Specifications for Pure Indium Preforms

It may seem obvious that we need dimensions on an engineering drawing to specify a solder preform, but we often receive drawings with missing dimensions or tolerances. I’m guilty of that too

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Reflecting on my Internship

With the summer internship season approaching, I can’t help but reflect back to the days when I was an intern for Indium Corporation. The year I was an intern was the first year the program

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How SEM Analysis can be used to Characterize a Solder Joint

Scanning Electron Microscopy (SEM) is a technique used to characterize cross sections of solder joints to identify a root cause to a soldering failure. Although there are many different detection

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Starvation Voids: When too little (paste) becomes too much (voiding)

When I was first introduced to QFN voiding, it appeared to be a straightforward issue: outgassing from flux creates pockets of entrapped air causing reliability problems. But I’ve since come to

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Why Do We Need to Go Thinner?

For the plethora of applications that require a high-melting die-attach solder, 80Au20Sn is a great choice to ensure good performance and reliability. Typical applications for 80Au20Sn in die-attach

At Indium we research, develop, and manufacture advanced electronics assembly materials solutions to the challenges of today, tomorrow, and the future.