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Autonomous Vehicles Even Farther Out in Time
Folks, Readers of this blog will remember that I have been a skeptic of self-driving cars emerging in the near term. I am even less sanguine today. A recent article supports my perspective. Humans
Metal Loading: Powder Size for Printing and Dispensing
At Indium Corporation, we get a lot of questions about solder paste – its composition, its application, and best practice advice.Many of those questions often involve inquiries aboutthe metal
Thixotropy: An Important Solder Paste Property
Folks, To the SMT process engineer, the second most important thixotropic material in their lives is solder paste. If solder paste was not thixotropic, it would be difficult to print and would likely
Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling: Part III
Previously in this blog series,we discussed some of the best practices for attaching thermocouples to a printed circuit board (PCB) for reflow profiling. Today, I will end this series with a few more
Indium Atoms in Superfluid Helium
While researching new potential applications for indium, I’m generally more interested in the ends than the means. In a departure from that outlook, two related studies have me more interested
Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling: Part I
In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep best practices for attaching thermocouples in mind. The first thing to remember is that a
Best Practices for Attaching Thermocouples to a PCB for Reflow Profiling Part II
As discussed in a previous blog post, it is important to followbest practices for attaching thermocouples to a printed circuit board (PCB) toaccurately measure the reflow profile of an assembly.
Liquid Metal Experimentation with Miloš Lazić (Part 4)
We are back today to finish our conversation with Miloš Lazić. If you missed the first three parts, feel free to jump back to the beginning here. Jim: What interests you about this material
Liquid Metal Experimentation with Miloš Lazić (Part 3)
Yesterday, in Part 2 ofour interview, Miloš mentioned how using a hybrid solid/liquid TIM provides benefits over thermal grease. Today we discuss the challenges to working with liquid metal,
Liquid Metal Experimentation with Miloš Lazić (Part 2)
In yesterday’s post, Miloš and I discussed what he’s been working on in the
Liquid Metal Experimentation with Miloš Lazić (Part 1)
I recently caught up with Miloš Lazić,one of our Technical Support Engineers who has taken a special interest in liquid metals. In the lab, Miloš has been experimenting with and
Size Does Matter!
Size matters. That statement rings true for many things in life. Alarger vehicle can transport more people, but you may have trouble finding appropriate parking. Aperson with smaller hands can easily
Trade Names of Low Temperature Alloys
“Low melt alloys” is a term some people use to describe alloys that melt at temperatures lower than more traditional SnPb or SnAgCu alloys. You may have heard of (or perhaps are looking
Indium Skunk Works
Disclaimer If not knowing all the details about a topic may disturb you, it’s best to skip to a different post. I suggest the following: The Complete Introduction to Pure Indium Preforms Now
Zarrow and Hall’s “Board Talk” Becomes a Book
Folks, There are a few good books that relate to electronics assembly. Ray Prasad’s Surface Mount Technology: Principles and Practice comes to
Come Visit Our Brand New Website
Have you had a chance to look at the new Indium Corporation web site?It has a brand new format and some new features that we think you will like! The first feature we have added right on the home
Engineering Drawing / Specifications for Pure Indium Preforms
It may seem obvious that we need dimensions on an engineering drawing to specify a solder preform, but we often receive drawings with missing dimensions or tolerances. I’m guilty of that too
Reflecting on my Internship
With the summer internship season approaching, I can’t help but reflect back to the days when I was an intern for Indium Corporation. The year I was an intern was the first year the program
How SEM Analysis can be used to Characterize a Solder Joint
Scanning Electron Microscopy (SEM) is a technique used to characterize cross sections of solder joints to identify a root cause to a soldering failure. Although there are many different detection
Starvation Voids: When too little (paste) becomes too much (voiding)
When I was first introduced to QFN voiding, it appeared to be a straightforward issue: outgassing from flux creates pockets of entrapped air causing reliability problems. But I’ve since come to
Why Do We Need to Go Thinner?
For the plethora of applications that require a high-melting die-attach solder, 80Au20Sn is a great choice to ensure good performance and reliability. Typical applications for 80Au20Sn in die-attach
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