Indium Blog

PanPac is a great opportunity to learn more about new technologies!

Winter is upon us, especially here in the Northeast USA. If you want to warm up be sure to go to the SMTA Pan Pacific conference February 6-9 in beautiful Kauai, HAWAII where my colleagues, Tim Jensen Product Manager for Engineered Solders, and Brook Sandy-Smith, Technical Support Engineer - Printed Circuit Board Assembly Materials, will be presenting.

Brook is presenting two papers titled, Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes, and Volumetric Characterization of Reservoir Printing in Deep Cavities. Tim is presenting a paper entitled Reinforced Solder Preforms for High–Reliability and Low Voiding, which I co-authored.

Tim’s paper talks about how Indium Corporation’s reinforced solder preforms, or InFORMs®, contribute to process improvements, such as reduced voiding, improved reliability, and enhanced solder performance in high-power applications. 

Starting on Feb. 9th, I will be discussing aspects of that paper in this blog. If you subscribe to this blog, you can be one of the first to learn about this technology.

If you want to know more about this topic, please feel free to contact me and I can send you a copy of the paper – after Feb. 9th of course.