Okay, this has no use for semiconductor packaging that I know of, but it is a neat trick that I discovered in the lab a couple days ago. If you clean a piece of steel with HBF4 that has copper dissolved in it, the copper will lightly ‘plate’ onto the steel and passivate it. Copper is much easier to solder to, and typical fluxes should work (otherwise you need a very specialized iron flux). This opens up a world of possibilities for those rusty old steel surfaces.
Why Solder To Steel When You Can Solder To Copper?
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
