Indium Corporation Wins Global Technology Award for Indium10.1HF
October 13, 2016
Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill.
Indium10.1HF Solder Paste is a halogen-free, no-clean formula that delivers ultra-low voiding in bottom terminated components (BTCs). The flux is specifically engineered to improve reliability by minimizing voiding while also providing excellent wetting, lower solder beading, and reduced solder balling to meet IPC specifications. Indium10.1HF also minimizes slumping and resists head-in-pillow defects.
Indium10.1HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste has robust reflow capability and a wide process window, accommodating various board sizes, component sizes, and throughput requirements.
Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for more than 10 years.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.