SOLDER Preforms
InFORMS® Reinforced Preforms
Reinforced solder preforms are designed to enhance solder joint reliability by adding strength, delivering consistent bondline thickness, and reducing stress concentrations in the interface.
Powered by Indium Corporation
- Uniform Bondline Thickness
- Improved Fatigue Resistance
- Even Stress Distribution
Product Overview
Reinforced Matrix for Precision Bondline Control
InFORMS® provide superior bondline consistency with an integrated matrix standoff, offering better control compared to single-point solutions susceptible to movement.
Mechanical Strengthening
InFORMS® remain within the solder after reflow, reinforcing the interface to resist solder creep, enhance fatigue resistance, and improve solder joint lifecycle reliability.
Customizable for Each Application
InFORMS® solder preforms are available in standard and custom shapes with precise tolerances, offering flexible matrix configurations for optimal design compatibility.
Compatible with a Wide Range of Solder Alloys
Leveraging Indium Corporation’s extensive alloy library, InFORMS® can be customized with or without flux-coating for increased reliability and repeatability in various applications.
Quick Facts
InFORMS® are specifically developed to realize superior realize superior solder joint reliability in a variety of applications.
Reinforced Preforms Products
InFORMS® reinforced solder preforms are available in various configurations, which can be selected based on the target design requirements for part dimensions and bondline thickness.
Solder Preform Requirements
| Description | Approximate Standoff (Microns) | Part Dimensions (x and y) per side (Millimeters) | Part Dimensions (z) (Microns) |
|---|---|---|---|
| ESM02 | 55 | 1.9-3.5 | >110 |
| ESM03 | 80 | 1.9-3.5 | >140 |
| SM04 | 110 | 3.5-11 | >165 |
| LM04 | 110 | >11 | >165 |
| LM06 | 165 | >11 | >215 |
| LM08 | 215 | >11 | >280 |
| ESM10 | 265 | 1.9-3.5 | >330 |
Product Data Sheets
InFORMS® PDS 97548 (A4) R13.pdf
InFORMS® PDS 97548 R13.pdf
Indalloy®301 LT for Preforms and InFORMS® PDS 100089 (A4) R3.pdf
Indalloy®301 LT for Preforms and InFORMS® PDS 100089 R3.pdf
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Clip-Attach / Lead-Frame
Applications Clip and Lead Frame Attach In power electronics packaging, clip-attach and lead-frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and
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Indalloy® 301LT offers versatile solder forms & enhances reliability with lower processing temperatures using InFORMS®
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